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Dixtra Electronic bars

Solder bars for wave soldering and THT/PTH assembly

Lead-free and tin-lead bars for wave and selective solder pots, in 25 kg boxes

Dixtra Electronic bars are used to fill and top up the solder pots of wave soldering machines, where the through-hole (THT) components of printed circuit boards are soldered. Dickmann manufactures them to EN ISO 9453:2020 in the lead-free alloys most widely used in wave soldering and, for applications where lead is permitted, in traditional tin-lead alloys. To choose the alloy, see also the lead-free alloys.

The Dixtra Electronic bar

Cross-section
Trapezoidal, 25 mm at the base and 8 mm at the top, 25 mm high
Length
330 mm at the base, 315 mm at the top
Weight
Approx. 1 kg per bar, depending on the alloy
Marking
DIXTRA ELECTRONIC embossed
Packaging
25 kg boxes
Minimum order
One 25 kg box
Standard
EN ISO 9453:2020, metals with purity above 99.9 %

Each lot is supplied with a certificate of analysis. Codes and alloys are also in the solder bar catalogue.

Alloys available as bars

Melting temperatures: typical values (solidus–liquidus).

AlloyCompositionMeltingWhen to choose it
99SnCuNiGe (SN100C equivalent)Sn/Cu0.7/Ni0.05/Ge227 °CSilver-free, less dross and copper erosion
SAC0307Sn99/Ag0.3/Cu0.7217–227 °CLow silver, lower cost in solder baths
SAC305Sn96.5/Ag3/Cu0.5217–220 °CWhen the specification calls for SAC305
Sn99.3Cu0.7Sn99.3/Cu0.7227 °CSilver-free, the most economical
Sn96.5Ag3.5Sn96.5/Ag3.5221 °CEutectic, bright joints
63Sn37PbSn63/Pb37183 °CEutectic tin-lead, where permitted
60Sn40PbSn60/Pb40183–190 °CTraditional tin-lead, where permitted
63Sn35Pb2AgSn63/Pb35/Ag2See technical sheetTin-lead with silver, where permitted

Tin-lead alloys are intended for applications where lead is permitted under the exemptions of the RoHS Directive.

Managing the wave solder bath

With lead-free alloys, the wave solder bath typically runs between 255 and 265 °C for SAC305, a few degrees higher for the silver-free alloys that melt at 227 °C. The right setting depends on the board, the contact time and the machine manufacturer's recommendations.

During production the bath dissolves copper from pads and component leads and picks up iron from the machine parts. When copper and iron exceed certain levels, the alloy becomes less fluid and bridging and icicles increase: this is why the bath must be analysed periodically and, if necessary, diluted or replaced.

  • Top up with bars of the same alloy as the bath: small, frequent additions keep level and temperature stable.
  • Remove dross from the surface of the solder pot regularly; a nitrogen atmosphere reduces its formation.
  • Do not mix different alloys: to change alloy, the solder pot must be emptied or diluted and then checked by analysis.
  • Have the bath analysed at regular intervals, depending on the volumes and boards produced.

For board fluxing see the alcohol-based and VOC-free no-clean fluxes; in selective soldering the bars fill the solder pot and solid wire tops it up automatically.

Bath analysis and dross recovery

Dickmann analyses customers' solder baths: just send a sample of at least 250 grams of alloy and you receive an impurity report with recommendations for correcting them. Dross and other process residues can be returned for recovery. Full details on the analysis and recovery services page.

THT or PTH?

THT (Through-Hole Technology) is the assembly technology for through-hole components; PTH (Plated Through Hole) is the plated hole in the circuit board into which the component lead is inserted. In Italy many EMS providers call THT assembly “PTH assembly”. Wave soldering solders all the THT components of a board in a single pass; for mixed-technology boards with few THT components, selective soldering is often used. See the guide to selective soldering and to consumables for electronics soldering.

Frequently asked questions about wave soldering bars

The Dixtra Electronic bar weighs approx. 1 kg, depending on the alloy, and is packed in 25 kg boxes. The minimum order is one box.

To keep bath costs down, the silver-free 99SnCuNiGe (SN100C equivalent) or the low-silver SAC0307 are used. SAC305 is used when the specification calls for it; Sn99.3Cu0.7 is the most economical.

No: it changes the composition and the melting range of the bath. To switch to another alloy, the solder pot must be emptied or diluted and the bath checked by analysis.

It depends on volumes, boards and alloy. Periodic analysis shows when dissolved copper and iron are approaching their limits: Dickmann offers bath analysis on a sample of at least 250 grams.

Yes, for filling the solder pot. For automatic top-up, solid wire from 0.5 to 4 mm in the same alloy is used.

Yes, the bar alloys are also used in the HASL solder pots of printed circuit board manufacturers. Contact us about the alloy and quantities.

The standard format is the Dixtra Electronic bar of approx. 1 kg, designed to be added to the solder pot without tools. For automatic top-up there is solid wire; for other formats, contact us.

Certificate of analysis for each lot, RoHS and REACH declarations and safety data sheet. Dickmann operates a quality management system certified to ISO 9001:2015.

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