Dickmann solid wire

Solid solder wire for selective soldering and automatic wire feeders

Solder alloy without flux core, from 0.5 to 4 mm on spools from 0.25 to 4 kg

Solid wire is 100 % solder alloy, with no flux core. In selective soldering machines it automatically feeds the solder pot and keeps the bath level constant without introducing flux into the molten alloy. Dickmann manufactures it to EN ISO 9453:2020 in the lead-free alloys most widely used in selective soldering, in diameters from 0.5 to 4.0 mm and on spools from 0.25 to 4 kg. To choose the alloy, see also the guide to selective soldering.

Why solid wire in the solder pot

Constant bath level

The feeder adds alloy as the solder pot is consumed: wave height and contact with the board remain stable.

No flux in the bath

Without a flux core, no residues are introduced into the molten alloy: the flux is applied to the board, by spray or drop-jet.

Same alloy as the bath

The wire must be chosen in the same alloy as the solder pot, so as not to alter its composition and melting range.

Automatic dosing

Continuous top-up avoids large additions of bars, which cool the bath and cause its temperature to fluctuate.

Alloys available as solid wire

Alloys manufactured to EN ISO 9453:2020. Melting temperatures: typical values (solidus–liquidus).

Alloy	Composition	Melting	Typical use
99SnCuNiGe (SN100C equivalent)	Sn/Cu0.7/Ni0.05/Ge	227 °C	Selective and wave, silver-free
SAC0307	Sn99/Ag0.3/Cu0.7	217–227 °C	Selective and wave, low silver
SAC305	Sn96.5/Ag3/Cu0.5	217–220 °C	Selective where SAC305 is specified
99.3Sn0.7Cu	Sn99.3/Cu0.7	227 °C	Selective, tinning, lowest cost
96.5Sn3.5Ag	Sn96.5/Ag3.5	221 °C	Eutectic, bright joints
97Sn3Cu	Sn97/Cu3	227–310 °C	Copper pipes for water and heating
97Sn3Ag	Sn97/Ag3	221–224 °C	Copper pipes, stronger joints
95Sn5Ag	Sn95/Ag5	221–245 °C	High operating temperature
95Sn5Sb	Sn95/Sb5	235–240 °C	High operating temperature
Tin-lead alloys	50Sn50Pb, 60Sn40Pb, 46.5Sn50Pb3.5Ag	See technical sheet	On request, where lead is permitted

Codes and packaging are in the solid wire catalogue.

Diameters and spools

Diameters: from 0.5 to 4.0 mm
Spools: from 0.25 to 4 kg, in all types
Standard: EN ISO 9453:2020

Diameter and spool depend on the wire feeder of the soldering machine: tell us the machine model and the solder pot alloy and we will propose the right format.

Solid wire, flux-cored wire or bars?

Format	Flux	Typical use
Solid wire	None, applied separately	Automatic solder pot top-up, robots, tinning
Flux-cored wire	In the wire core	Hand soldering and rework
Bars	None	Initial filling and manual top-up of solder pots

For hand soldering see the no-clean flux-cored wires; for the selective flux see the liquid fluxes.

Other uses of solid wire

Robotic soldering

With flux applied separately, when alloy and flux are to be controlled independently.

Tinning of conductors

Top-up of tinning baths for terminals, braids and copper wires.

Plumbing and heating

Lead-free 97Sn3Cu and 97Sn3Ag for copper pipes, with plumbing flux.

High temperature

95Sn5Sb and 95Sn5Ag for joints operating at higher temperatures than standard alloys.

Selective soldering, THT and PTH

Selective soldering is used to solder through-hole components (THT, Through-Hole Technology) on mixed-technology boards, after reflow of the SMT components, without exposing the whole board to a wave. PTH (Plated Through Hole) refers to the plated hole into which the component lead is inserted: in Italy many EMS providers call THT assembly “PTH assembly”. For mixed boards see also the solder pastes for SMT.

Frequently asked questions about solid wire

Yes, but not in the wire: in selective soldering the flux is applied to the board, by spray or drop-jet, before contact with the alloy. Solid wire is only used to top up the solder pot.

It depends on the soldering machine model and the feeder. We manufacture diameters from 0.5 to 4.0 mm: tell us the machine and we will propose a compatible diameter and spool.

Both reduce cost compared with SAC305. 99SnCuNiGe contains no silver and limits copper erosion and dross; SAC0307 contains 0.3 % silver. In any case, the wire must be chosen in the same alloy as the solder pot.

It is not recommended: it changes the composition and melting range of the bath. To change alloy, the solder pot must be emptied or diluted and the bath checked by analysis.

In a dry place and in its original packaging. As it contains no flux, solid wire does not have a shelf life like flux-cored wires or pastes.

Certificate of analysis for each lot, RoHS and REACH declarations and safety data sheet. Dickmann operates a quality management system certified to ISO 9001:2015.

Request a quote for solid wire

Tell us the solder pot alloy, diameter, spool and annual consumption