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Benchmark lead-free alloy

SAC305 solder alloy (Sn96.5/Ag3.0/Cu0.5) for electronic soldering

Lead-Free Alloy Sn96.5/Ag3/Cu0.5 - Industry Standard for Electronic Soldering

SAC305 is the lead-free solder alloy with composition Sn96.5/Ag3/Cu0.5, available from Dickmann in bars, wires and SMD pastes. It is the reference lead-free alloy in electronics: it melts at 217–220 °C and gives reliable joints with a satin appearance in SMT reflow, wave, selective and hand soldering. SAC305 alloys available from stock in Italy and Europe. Ideal for electronics, automotive and industrial applications. Discover also our other lead-free alloys.

Why Choose SAC305 Alloys for Electronics

Key advantages of SAC305 alloys over other lead-free solutions

Superior Reliability
Stable, durable joints: the benchmark alloy of electronics, validated by decades of production.
Optimal Melting Point
217-220°C: the ideal temperature for industrial processes and manual soldering
RoHS Compliance
Completely lead-free and compliant with all European and international regulations
Versatile Use
Available as flux-cored wires, SMD pastes, bars and sticks for every application
SAC305 lead-free solder joints on an SMD board

SAC305 Alloy Technical Data

Metallurgical and thermal properties of Sn96.5/Ag3/Cu0.5 alloys

PropertyValueUnitNotes
CompositionSn96.5/Ag3/Cu0.5%Optimal balance for electronics
Melting Point217-220°CIdeal soldering range
Density7.4g/cm³At room temperature
ComplianceRoHS/REACH-RoHS compliant

SAC305 in every format

SAC305 is the only alloy in the range available in every production format, from the solder pot to the paste.

FormatProductsProcess
BarsDixtra ElectronicWave and selective soldering
Solid wireFrom 0.5 to 4 mm, spools from 0.25 to 4 kgSolder pot top-up, robots
Flux-cored wireAlfa C, Alfa E, Impetol B, Dixtra No Clean, AIM GlowcoreManual soldering and rework
Solder pasteAIM H10, NC257-2, M8SMT reflow
SticksSAC305 stickManual soldering of large masses, top-ups

Typical process parameters

ProcessTypical valueNotes
ReflowPeak 240–250 °CProfile according to the paste technical sheet
Wave solderingBath 255–265 °CDepending on board and contact time
Selective solderingSolder pot 280–320 °CDepending on nozzle and thermal mass
Manual solderingTip 330–370 °CDepending on tip and thermal mass

Indicative values: the technical sheets of paste, flux and machine are authoritative.

SAC305, SAC0307 or 99SnCuNiGe?

SAC305 remains the standard choice for SMT reflow and when the specification requires it. In bath processes, where a lot of alloy is consumed, low-silver SAC0307 and silver-free 99SnCuNiGe reduce cost. When the specification calls for more silver, the step up is to SAC405. Alloy designation and purity are defined by IPC J-STD-006 and EN ISO 9453.

Applications of SAC305 Alloys

Industrial sectors where SAC305 alloys are the preferred standard

Automotive Electronics
Automotive Electronics
ECUs, sensors, safety systems, infotainment
Consumer Electronics
Consumer Electronics
Smartphones, tablets, TVs, household appliances
Medical Devices
Medical Devices
Diagnostic equipment, monitoring
Telecommunications
Telecommunications
5G, networking, critical infrastructure

SAC305 vs SAC405 vs Sn-Cu Alloys: Comparative Analysis

Detailed comparison of performance, cost and applications of lead-free alloys

AlloyCompositionMelting PointApplication Notes
SAC305Sn96.5/Ag3/Cu0.5217-220°CStandard for electronics, excellent balance
SAC405Sn95.5/Ag4/Cu0.5217–219 °CMore silver, for high-reliability specifications
Sn-CuSn99.3/Cu0.7227°CEconomical, for standard applications
99SnCuNiGeSn/Cu0.7/Ni0.05/Ge227°CSilver-free, for high volumes

💡 Nota: SAC305 alloys offer the best compromise between performance, reliability and cost for most modern electronic applications.

Frequently Asked Questions about SAC305 Alloys

Answers from Dickmann experts on SAC305 alloys

SAC305 offers the best balance between melting point (217°C), joint reliability, cost and availability. It has been extensively tested and validated by the global electronics industry.

SAC405 contains more silver (4 % versus 3 %): it slightly improves resistance to thermal cycling, but not to shock and drop, and it costs more. It is chosen when the specification requires it.

Yes, SAC305 is compatible with Sn, HASL, OSP and Ni/Au finishes. With suitable fluxes it wets all standard finishes well, although slightly less than lead-containing alloys.

Typical values: soldering iron 330–370 °C depending on tip and thermal mass, wave solder bath 255–265 °C, reflow with a peak of 240–250 °C. These temperatures are higher than those of leaded alloys.

Whiskers mainly concern the pure tin finishes of components rather than solder joints. The risk depends on finish, stresses and environment: for critical applications it should be assessed with the component supplier.

It depends on the conditions of use: temperature swings, number of cycles and type of component. With the right materials and process, and with validation on the product, SAC305 joints meet the reliability requirements of most applications. It is the most widely used and studied lead-free alloy in electronics.

Switch to SAC305 Alloys: the Industry Standard for Electronics

SAC305 stock in Italy · Certificate of analysis for every lot · Availability in Europe

Discover our complete range of soldering products, including SAC305 bars, flux-cored wires and SMD pastes. Our quality management system is ISO 9001 certified. Alternatives available: SAC 405, 99SnCuNiGe (SN100C equivalent).

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