Fluxes
Flux is the chemical element that makes tin wetting possible by eliminating surface oxides and temporarily protecting the clean metal during soldering. There is no universal formulation: the choice depends on substrate, process and post-soldering cleaning requirements.
Flux is the chemical element that makes tin wetting possible by eliminating surface oxides and temporarily protecting the clean metal during soldering. There is no universal formulation: the choice depends on substrate, process and post-soldering cleaning requirements. In electronics, no-clean fluxes (ROL0/ROL1 classes) with transparent and non-corrosive residue prevail, ideal for processes where cleaning is not planned. RMA/RA rosin-based fluxes guarantee greater activity and wide process window, useful on less clean PCBs or through-hole components. For mechanical soft soldering and plant engineering, high activity acid fluxes (often water-based) are used, effective on copper, brass and galvanized sheets, but requiring careful washing to avoid corrosion. We supply fluxes in liquid version for wave soldering (compatible with spray or foam systems), in gel/syringe for manual rework, and in paste for mechanical applications. VOC-free solutions are available to reduce environmental impact and improve line safety. J-STD-004 specifications define the type and level of activity (e.g. ROL0 = rosin, low activity, zero halogens); we perform SIR and corrosivity tests to validate suitability for customer processes. We help define the alloy-flux combination and parameters (pre-heating, deposit quantity, contact times) to optimize wettability, joint appearance and reliability. Each batch is traced; detailed technical and safety data sheets are available.
Fluxes
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Selection guide
In-depth pages on the alloys, processes and applications related to this category.
All technical guides →Industrial Applications of Fluxes
Dickmann AIM fluxes cover all needs: from no-clean for electronics to active formulations for difficult surfaces
Spray and foam fluxes for high-volume SMT lines. Controlled pre-soldering activation.
Gel and syringe fluxes for localized application on BGA, QFN, connector components.
High-activity fluxes for soft soldering of mechanical joints on copper, brass and steel.
Fluxes for electromedical equipment and avionics: low residues, removable with IPA.
Why Choose Dickmann AIM Fluxes
World-leading technology, complete range and specialized Italian technical assistance
Complete AIM Range
AIM partner: exclusive access to no-clean, water-soluble, RMA formulations tested in millions of boards/year worldwide.
Dedicated Technical Support
Expert team for optimal flux selection, defect troubleshooting and process optimization. Free sample testing.
Complete Certifications
Compliant with IPC J-STD-004, ISO 9001, RoHS, REACH.
Frequently Asked Questions
Answers to the most common questions about soldering fluxes
No-clean leaves transparent non-corrosive residues that do not require removal, ideal for consumer electronics and automotive. Water-soluble has superior activity for oxidized surfaces, but requires complete washing with DI water (<10μS/cm) within 24 hours to avoid corrosion. Choice depends on: PCB finish type, production volumes, and cleaning requirements (IPC A-610).
Yes, they contain isopropanol (IPA) 60-80% with flash point ~12°C. Precautions: store away from flames and sparks, use in ventilated environments, avoid vapor accumulation (<1% in air). For critical environments, we offer VOC-free water-based fluxes (NC275B) without flammable solvents, ideal for automotive and aerospace.
Selection criteria: 1) Alloy type (lead-free requires more active flux). 2) PCB finish (OSP requires ROL1, ENIG works well with ROL0). 3) Application method (spray, foam, drop-jet). 4) Cleaning requirements (no-clean vs water-soluble). For lead-free wave, we recommend NC264-5 (alcohol no-clean) with solid content 2.5-3% for optimal wetting.
Depends on type: No-clean alcohol 6-12 months (evaporation reduces effectiveness). Water-soluble 12-18 months (stable in water). Gel flux 12-24 months. Signs of degradation: color change, phase separation, altered viscosity, reduced wetting performance. Always store sealed at 15-25°C, away from direct light. Label opening date.
Yes, our VOC-free formulations (NC275B) offer equivalent performance with environmental benefits: zero VOC emissions, REACH compliance, no flammability risk. Slightly slower to dry (important for wave soldering), but ideal for aerospace, automotive, and sectors with environmental constraints. They also reduce costs for vapor extraction/filtration.