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Professional Electronics Solutions

Electronic Soldering Consumables: Solder Paste, Wires, Bars and Fluxes

Professional Electronic Soldering with Lead-Free SAC305 Alloys and Advanced SMD Techniques

Electronic soldering solutions with SAC305 alloys and lead-free alloys for SMD and PCB. Ideal for no-clean flux-cored wires and SMD solder pastes. Products made with a certified ISO 9001 quality system.

Why Professional Electronic Soldering Requires Expertise

Critical aspects of electronic soldering for reliable results

Extreme Precision
Miniaturised components require high-precision soldering techniques and thermal control
RoHS Compliance
Lead-free alloys for equipment subject to RoHS; lead-containing alloys remain for exempted uses
Critical Reliability
Joints must withstand thermal cycling, vibration and mechanical stress for years
Advanced Technologies
SMD, BGA and QFN require specific thermal profiles and optimised materials
Hand soldering a component on a circuit board

Technical Parameters for Professional Electronic Soldering

Optimal temperatures and materials for SMD and THT electronic soldering

ParameterSMDTHTNotes
Soldering Iron Temperature350–400 °C350–400 °CTypical values with lead-free alloys (300–350 °C with tin-lead), depending on tip and thermal mass; the wire data sheet applies
Recommended AlloySAC 305SAC 305 / Sn-CuLead-free RoHS compliant
Wire Diameter0.5-0.8mm0.8-1.2mmDepending on pad size
Flux TypeNo-CleanNo-Clean / RMATo reduce post-soldering cleaning

Which material for which process

In an electronics assembly company several processes coexist, each with its own consumable. This is the map of Dickmann products by process.

ProcessMaterialTypical alloys
SMT reflowAIM H10, NC257-2, M8 solder pastesSAC305, REL22, REL61
Wave solderingDixtra Electronic bars for the solder potSAC0307, 99SnCuNiGe, SAC305, Sn99.3Cu0.7
Selective solderingBars and solid wire for top-up99SnCuNiGe, SAC0307, SAC305
Hand soldering and reworkNo-clean and rosin flux-cored wiresSAC305, SAC0307, 99SnCuNiGe
Wave and selective fluxingAlcohol-based and VOC-free no-clean fluxes—
BGA rework and touch-upGel fluxes (paste flux)—

Typical process temperatures

With lead-free alloys, process temperatures are higher than with tin-lead. For SAC305 alloy the typical values are: reflow peak 240–250 °C, wave soldering bath 255–265 °C, selective solder pot 280–320 °C, soldering iron tip 350–400 °C. Silver-free alloys such as 99SnCuNiGe melt at 227 °C and require a few degrees more. The exact values depend on the board, the components and the machine.

Common defects and causes

DefectProcessCommon causes
BridgingReflow, wave, hand solderingToo much alloy, unsuitable stencil or flux, low temperature
VoidsReflowPaste and thermal profile; on QFN and BTC choose low-voiding pastes
TombstoningReflowUneven heating of the two pads, different deposits
Solder ballsReflow, waveMoisture in the paste or excess flux
Unfilled holeWave, selectiveInsufficient preheating, flux not activated

For solder joint acceptability criteria, the industry reference is the IPC-A-610 standard.

SMT, THT and mixed-technology boards

SMT is surface mount technology, THT is through-hole technology. On mixed-technology boards, reflow soldering with solder pastes comes first, then the THT components are soldered by wave or selective soldering, with solid wire for topping up the solder pot. Touch-up and rework are done with flux-cored wires and gel fluxes.

Electronic Soldering Applications

Sectors and components where to excel

Electronic soldering consumer electronics: Smartphones, tablets, TVs, smart home appliances
Consumer Electronics
Smartphones, tablets, TVs, smart home appliances
Electronic soldering automotive electronics: Control units, sensors, infotainment systems
Automotive Electronics
Control units, sensors, infotainment systems
Electronic soldering medical devices: Diagnostic equipment, electromedical devices and laboratory instrumentation
Medical Devices
Diagnostic equipment, electromedical devices and laboratory instrumentation
Electronic soldering industry 4.0: IoT, industrial sensors, automation
Industry 4.0
IoT, industrial sensors, automation

SMD vs THT: Which Technique to Choose?

Comparison of the two main electronic soldering techniques

AspectSMD (Surface Mount)THT (Through Hole)
Component DensityVery highMedium-low
Production SpeedVery fast (automated)Slower (often manual)
Mechanical StrengthGoodExcellent
RepairabilityDifficultEasy
Equipment CostHigh (pick&place)Low

Frequently Asked Questions about Electronic Soldering

Expert answers to the most common questions

SAC 305 (Sn96.5/Ag3/Cu0.5) is the standard for electronics. It offers excellent reliability, RoHS compliance and a melting range of 217–220 °C.

No-clean flux leaves non-corrosive residues that can normally stay on the board. RMA (Rosin Mildly Activated) is a designation from the old military standard for mildly activated rosin, generally class ROL0 or ROL1: cleaning depends on the specification.

Use the right amount of alloy, the correct temperature (typically 350–400 °C with lead-free alloys; the wire data sheet applies), a clean soldering iron tip and precise movements. Flux helps prevent bridges.

For components with thermal pads or a large thermal mass, preheating the board improves wetting. For multilayer ceramic capacitors (MLCC) the manufacturers specify preheating and a maximum tip temperature, lower for large sizes: follow the component manufacturer's instructions.

With the correct alloy, flux and thermal profile, joints last as long as the equipment. Reliability depends more on the process and the board design than on the alloy alone.

Optimise Your Electronic Soldering with Dickmann

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