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Silver-free lead-free alloy

99SnCuNiGe, the SN100C Equivalent Alloy: Silver-Free Lead-Free Solder

Eutectic Sn/Cu0.7/Ni0.05/Ge at 227 °C made by Dickmann, equivalent to SN100C® for wave, selective and HASL soldering

99SnCuNiGe is the silver-free Dickmann alloy equivalent to SN100C®, for selective soldering, wave soldering and HASL. Compared with the Sn99.3Cu0.7 tin-copper alloy, nickel reduces copper dissolution and makes joints brighter; compared with SAC305 and low-silver SAC0307, it eliminates silver entirely. Full overview of lead-free alloys.

SN100C® and the Dickmann 99SnCuNiGe alloy

Trademark notice

SN100C® is a registered trademark of Nihon Superior Co., Ltd. The Dickmann 99SnCuNiGe alloy is an equivalent Sn-Cu-Ni-Ge formulation made in Italy; on this page the name SN100C is used for comparison purposes only.

The Dickmann Sn-Ni-Ge alloy family

Base alloy

99SnCuNiGe

Composition Sn/Cu0.7/Ni0.05/Ge, eutectic at 227 °C

Copper-free version

99SnNiGe

Copper-free top-up alloy, to lower copper in 99SnCuNiGe baths

Enhanced version

99SnCuNiGe+

Higher mechanical strength

Garanzia Qualità Dickmann: All alloys are made from metals with purity ≥ 99.9 % under an ISO 9001:2015 certified quality system, are RoHS and REACH compliant, and have batch traceability.

Why choose the SN100C equivalent alloy

Advantages of 99SnCuNiGe, like those of Sn-Cu-Ni-Ge alloys, over SAC305 and Sn-Cu

Silver-free, lower cost
0 % silver versus 3 % in SAC305: the alloy cost follows only the price of tin, with savings that grow with the bath volumes.
Eutectic at 227 °C
It melts and solidifies at a single temperature, with no pasty range: uniform solidification reduces defects such as shrinkage cracks.
Bright joints
Nickel refines the joint structure, which is bright and smooth and easier to inspect, including with AOI systems.
Less dross, less copper dissolution
Compared with Sn-Cu without nickel, germanium limits oxidation of the bath surface and nickel slows the dissolution of copper from pads and tips.
Freshly cast 99SnCuNiGe alloy bars

99SnCuNiGe alloy technical data

Properties of the Sn/Cu0.7/Ni0.05/Ge alloy, SN100C equivalent

PropertyValueUnitNotes
CompositionSn/Cu0.7/Ni0.05/Ge%Silver-free, traces of germanium
Melting point227°CEutectic, no melting range
Silver content0%Cost linked only to tin
Density7.4g/cm³Typical value at room temperature
Metal purity≥ 99.9%High Grade base metals
StandardsEN ISO 9453:2020, IPC J-STD-006-Alloy designation and purity
ComplianceRoHS, REACH-Lead-free alloy

Where the 99SnCuNiGe alloy is used

Bath processes and high-volume production

Wave and selective soldering

Solder pots for THT and mixed-technology boards: stable bath, bright joints and good hole fill in plated through-holes.

PCB HASL

Silver-free lead-free alloy for the HASL pots of PCB fabricators, with limited copper dissolution.

LED lighting

High-volume LED assemblies where alloy cost matters and silver is not needed.

Industrial and consumer electronics

THT and mixed-technology boards produced in large volumes, where SAC305 is not required by the specification.

99SnCuNiGe (SN100C equivalent), SAC305 and Sn99.3Cu0.7 compared

Qualitative differences between the alloys most used in solder baths

Characteristic99SnCuNiGe (SN100C equiv.)SAC305Sn99.3Cu0.7
Silver content0 %3 %0 %
Relative costLowHighLowest
Melting227 °C (eutectic)217–220 °C227 °C (eutectic)
Joint appearanceBrightMatteMatte
Dross formationReducedMediumMedium
Copper dissolutionReducedHigherHigher
Typical useWave, selective, HASLSMT reflow, SAC specificationsWave, wiring, minimum cost

Typical qualitative values of Sn-Cu-Ni-Ge alloys compared with SAC305 and with Sn-Cu without nickel. For data on your production line, contact us.

Frequently asked questions about the 99SnCuNiGe alloy

Answers from Dickmann technicians

It is the Dickmann tin-based lead-free alloy with 0.7 % copper, about 0.05 % nickel and traces of germanium, with no silver. It is a formulation equivalent to Nihon Superior's SN100C®.

No. SN100C® is a registered trademark of Nihon Superior Co., Ltd. 99SnCuNiGe is a Dickmann alloy with an equivalent composition, made in Italy under its own designation.

99SnCuNiGe contains no silver and costs less than SAC305; in bath processes it gives bright joints and limits dross formation. SAC305 melts lower (217–220 °C) and remains the standard choice for SMT reflow or when the specification requires it.

The alloy is eutectic and melts at 227 °C, about 7 °C above the SAC305 liquidus. Wave soldering baths typically operate between 260 and 270 °C; the selective soldering pot between 280 and 320 °C, depending on nozzle and thermal mass.

Yes, it works with wave and selective soldering machines and with fluxes for lead-free soldering. Switching from another alloy requires emptying or diluting the solder pot and checking the copper and nickel content of the bath with an analysis.

In wave and selective soldering of THT and mixed-technology boards, in PCB HASL and in general in high alloy-consumption processes where silver is to be eliminated.

No, it is a lead-free alloy compliant with RoHS and REACH.

Less than SAC alloys, because it contains no silver; the price follows tin market prices. Contact us for an up-to-date quotation.

As bars for solder pots, compliant with EN ISO 9453:2020, and as solid wire from 0.5 to 4.0 mm on spools from 0.25 to 4 kg. For other formats, contact us.

Request a quotation for the SN100C equivalent alloy

Discover our complete range of soldering products including 99SnCuNiGe bars, flux-cored wires and SMD pastes. Certified ISO 9001. Request a personalized quote.

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