SMD Pastes
Solder paste for SMT technology is a homogeneous suspension of metallic particles (alloy powder) in an organic vehicle containing flux and rheological additives. Its function is twofold: to allow precise deposition through stencil and to guarantee, in reflow, the formation of wetted and uniform joints. For this reason, the formulation must balance viscosity, thixotropy, stencil life and flux activity.
Lead-Free
Explore our range of smd pastes lead-free, designed to ensure maximum quality and reliability in your applications.
Description
H10 Halide-free and no-clean solder paste is designed to deliver robust and stable performance in automotive, LED lighting and aerospace applications. H10 solder paste can guarantee transfer efficiency greater than 90% with area ratios of 0.50 and stencil life greater than 8 hours. H10's powerful wetting characteristics eliminate NWO (Head-in-Pillow) defects and improve pad coverage on all surface finishes. H10 reduces void formation on BGA, BTC and LGA components, and offers greater electrochemical reliability on all low profile devices. H10 is halogen-free according to EN14562 and halide-free according to the current revision of the IPC J-Std-004 standard. H10 is compatible with AIM's entire line of no-clean flux chemistries. Lead-free alloys
Alloy
SAC305, REL22™, REL61™
Description
NC 257-2 paste has been formulated to offer a wide process window for printability, wettability and bed-of-nails testing. Solder residues are clear and reduced in volume. It can be used in air, nitrogen and vapor-phase reflow. Tack time is high even in presence of non-optimal environmental conditions.
Alloy
SAC305 - REL 61 - REL 22
Description
M8 no-clean paste is formulated for high-density electronic circuits. It is an evolution of NC 258 and, in combination with T4 particle size for both lead-free and leaded alloys, offers an effective solution for the most sophisticated applications. An innovative formulation allows consistent wettability with various processes and thermal profiles. M8 eliminates Hip defects on BGAs, minimizes voids on QFN/BTC components, offering transparent residues that can be safely left in place. Where required, these can be removed or covered with coating.
Alloy
SAC305 - REL 61 - REL 22