Bars
Bars and sticks are the reference format for feeding wave soldering baths and for dip tinning processes. They are made from high purity metals (≥ 99.9%) and undergo treatments that reduce oxidation tendency, improving bath stability and containing dross formation.
Bars and sticks are the reference format for feeding wave soldering baths and for dip tinning processes. They are made from high purity metals (≥ 99.9%) and undergo treatments that reduce oxidation tendency, improving bath stability and containing dross formation. Large format ingots, typically in the order of tens of kilograms, are used for initial filling of tanks; sticks, with lower unit weight, allow progressive topping up during production, reducing thermal shocks and maintaining more stable alloy composition. On request, customized formats can be made to adapt to automatic loading or specific machine constraints. From a metallurgical point of view, bath management is fundamental: contamination from copper, iron or aluminum must be kept within defined limits to avoid wetting defects and opaque soldering. The most used lead-free alloys are 99.3Sn0.7Cu (eutectic at 227°C), SAC305 (for continuity with SMT joints) and 99SnCuNiGe (SN100C equivalent), particularly appreciated for lower dross formation and high wettability even in air. Low silver variants (e.g. SAC0307) allow cost containment while maintaining adequate performance. Typical applications include wave soldering of through-hole PCBs, dip-soldering of connectors and tinning of conductors or mechanical parts. Control of bath temperature, atmosphere (air/nitrogen) and PCB preheating directly affects joint quality. To maintain the alloy within specification, we propose periodic bath analyses and support in dross and residue management. Each bar/rod is marked with alloy code and batch number, guaranteeing traceability. Compositions comply with ISO 9453 / J-STD-006; targeted additions (Ni, Ge, Sb, Bi) are available to optimize fluidity, strength or melting temperature according to process.
Bars Lead-Free
Explore our range of bars lead-free, designed to ensure maximum quality and reliability in your applications.
| Name | Description | Alloy | Scheda |
|---|---|---|---|
| Dixtra Electronic | We produce bars for electronics starting from High Grade raw materials using a process that guarantees oxide elimination and high quality. We can offer all main alloys, in compliance with EN ISO 9453: 2020 (E) standards. | 99.3Sn0.7Cu - 96.5Sn3.5Ag - 99SnCuNiGe (SN100C equivalent) - SAC305 - SAC0307 |
Description
We produce bars for electronics starting from High Grade raw materials using a process that guarantees oxide elimination and high quality. We can offer all main alloys, in compliance with EN ISO 9453: 2020 (E) standards.
Alloy
99.3Sn0.7Cu - 96.5Sn3.5Ag - 99SnCuNiGe (SN100C equivalent) - SAC305 - SAC0307
Main Lead-Free Alloys
Discover the most widely used lead-free solder alloys in the modern electronics industry. RoHS compliant, ISO 9001:2015 certified and fully traceable.
Selection guide
In-depth pages on the alloys, processes and applications related to this category.
- Wave soldering bars: format, alloys and bath
- HASL alloys for printed circuit boards
- SAC0307 alloy for wave, selective and HASL
- 99SnCuNiGe (SN100C equivalent)
Industrial Applications of Solder Bars
Dickmann bars guarantee high purity and thermal stability for high-volume industrial processes
Continuous feeding of SMT and through-hole soldering baths. Dross and oxidation reduction.
High-volume industrial processes with batch traceability and ISO 9001 certification.
ECU units, ADAS sensors, automotive-grade electrical component assembly.
Electromedical equipment and avionics, where purity and reliability are specification requirements.
Why Choose Dickmann Solder Bars
High purity, guaranteed stability and technical support from the Italian leader in soldering alloys
Purity >99.9%
Highest quality base metals to reduce dross formation in industrial baths. ISO 9001 certified impurity control.
Thermal Stability
Optimized composition to minimize property variations during repeated thermal cycles. Superior oxidation resistance.
Free Impurity Analysis
Periodic soldering bath analysis service included. Detailed report with recommendations to optimize the process.
Frequently Asked Questions
Answers to the most common questions about wave soldering bars
Our SAC305 and SnCu0.7 bars have ≥99.9% purity certified per batch. Each casting is analyzed with XRF spectrometry to verify: silver, copper, tin content, and absence of critical contaminants (lead <100ppm, antimony, bismuth). Ideal for automotive and aerospace production with traceability requirements.
To minimize dross (surface oxide): 1) Maintain optimal temperature (250-260°C for SAC305, do not overheat). 2) Use protective oil cover or inert atmosphere (nitrogen). 3) Regularly clean the bath removing oxide. 4) Our high-purity bars produce up to 30% less dross compared to generic alloys.
With proper management: 3-6 months for continuous production. Factors affecting duration: level of dross produced, top-up frequency, operating temperature, and production volumes. We recommend monthly analysis of bath composition to maintain alloy within specifications (±0.5% for Ag and Cu).
Bars are designed for solder baths (wave, selective). For manual soldering, we recommend flux-cored or solid wires. Bars can be used for dip tinning of connectors and terminals. If necessary, bars can be melted in small crucibles for industrial tinning applications.
NO, never mix. A SnPb bath contaminated with SAC305 creates unstable alloys with poor mechanical properties. For lead-free transition: completely drain the SnPb bath, thoroughly clean the crucible with solvent and brush, fill with fresh lead-free alloy. Dispose of used SnPb alloy according to special waste regulations.